We develop semiconductor products for high-bandwidth, low-latency, and low-power data transmission across servers, AI accelerators, data centers, and high-performance computing systems.

We focus on chip solutions for high-speed optical modules, optical-electrical interfaces, and data center optical interconnect, supporting 400G, 800G, and future higher-speed applications.

We provide reliable wired communication chips and interface solutions for Ethernet, communication equipment, industrial networks, and server systems.

We explore IO Die, Die-to-Die interconnect, UCIe, and Chiplet-based semiconductor products for advanced packaging and heterogeneous integration.

We plan high-bandwidth, low-latency, and scalable network switching silicon solutions for data center switching, AI cluster interconnect, and high-performance networking systems.