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Applications
Afeon Semi’s products and technologies can be applied to AI computing, data centers, optical communication, high-speed networking, servers, communication equipment, and advanced packaging systems.
AI Computing and Acceleration Data Center and Cloud Infrastructure Optical Communication and High-Speed Networking Chiplet and Advanced Packaging Communication Equipment and Industrial Networking
Chiplet and Advanced Packaging

Chiplet technology can enhance chip scalability and reduce the complexity of ultra-large-scale chip design. Afeon Semi focuses on IO Die, Die-to-Die interconnect, and advanced packaging co-design.